Packaging design goes far beyond physical structure and associated graphics — it involves engineering the entire production chain that is driven from understanding the true needs of the package from cradle to cradle. This may involve genetically engineering plants to derive bioplastics. It may include printed electronics that enable intelligent monitoring of product conditions. It could be objectively determining the consumer experience when buying or utilizing a package.
Clemson University is a hotbed of cutting-edge research in a wide range of areas far outside what is thought of as packaging-related.
Although very successful in academic circles, much of this research has been done in relative isolation, and in many cases, without practical application or development. The Sonoco Institute will serve to match the packaging market needs and future directions with the multi-disciplinary opportunities on campus by focusing people, resources and attention on issues that otherwise could not be addressed.