Streamlined Package Design
November 3-5, 2008
Location: Clemson University
Instructor: Andrew Hurley, ruperth@clemson.edu
Cost: Individual - $495
Register Now — Click Here
Event Overview
This seminar outlines the opportunities and challenges of modern-day package design. This seminar illustrates the value of understanding design theory, virtual tools, and new technologies to maximize product and package innovation, efficiency, and sustainability.
Location: Clemson University
Instructor: Andrew Hurley, ruperth@clemson.edu
Cost: Individual - $495
Event Overview
Event Schedule
Target Audience
- Marketers responsible for product and/or package development interesting in understanding the package design workflow, organizational/design theory, and prototyping technologies.
- Packaging Engineers working for a wide range of companies responsible for carrying out package development, specifications, CAD design, and prototyping
- Product Developers who are curious about design theory, design innovation, and CAD fundamentals.
Presenters and Contributors
- Andrew Hurley, Packaging Science
- Chip Tonkin, Sonoco Institute
- Jay Sperry, Graphic Communications
- Heidi Larsen, EskoArtwork