Sonoco Institute
Packaging Design Workflow
PackageDesign

November 16-19, 2009   


Location: The Sonoco Institute at Clemson University
Coordinator: Andrew Hurley, ruperth@clemson.edu
Cost: Individual - $995, Group (3+) $950

Register Now — Click Here 

 

Event Overview

Seminar presents a streamlined packaging design workflow that outlines the opportunities and challenges of modern-day package design. This seminar surveys a state-of-the-art, efficient, and holistic approach to designing, optimizing, prototyping, qualifying, and producing packaging.

Seminar outline:

  • design your own product
  • develop packaging in a completely virtual workflow
  • optimize your product and packaging using FEA
  • develop primary, secondary, tertiary and quaternary packaging
  • apply artwork virtually on structural designs
  • develop and optimize transport packaging
  • prototype your custom product and packaging
  • test the actual prototypes, physically, in a certified ISTA laboratory

Seminar highlights are noted below:

  • introduction to product design, virtual environments, working with 3d models

  • product and part prototyping. Hands-on experience with FDM prototyping

  • hands-on application with specialized paperboard and corrugated virtual tools

  • integrated workflows within structural and graphic design software

  • product and package optimization with an introduction to Finite Element Analysis (FEA)

  • specialized packing, palletizing, and truck loading efficiency tools

  • hands-on designing using state-of-the-art sample tables and UV-flatbed printing

  • introduction to testing standards within ISTA, ASTM, and ISO

  • hands-on testing and package qualification in an ISTA certified laboratory


Schedule at a Glance

Day One - Begin 8:30am

8:30     Breakfast

9:00     Introduction and Tour: Harris A. Smith Building

9:30     Introduction to Product Design with Solidworks 2009

12:00     Lunch   

1:30       Product design session

3:30       Overview of Rapid Prototyping and FDM

4:00       Introduction to Packaging Design with ArtiosCAD 7.4

5:30     Social Hour

 

Day Two - Begin 8:30am

8:30     Breakfast

9:00     Receive prototypes, comments

9:30     Virtual packaging workflow with ArtiosCAD, Esko Suite, Visualizer, and Adobe Illustrator

12:00     Lunch   

1:30      FEA overview

3:30      Packaging Design session

5:00     Social Hour

 

Day Three - Begin 8:30am

8:30     Breakfast

9:00     Sample cutting and printing session

12:00    Lunch   

1:30      Quaternary packaging design and optimization tools

3:30      Overview of ISTA, ASTM, and ISO testing procedures

4:00      ISTA 4AB lab

5:00     Social Hour


Day Four - Begin 8:30am

8:30     Breakfast

9:00     Tour: Newman Hall

10:00    Package Testing and Qualification session   

12:00    Lunch

1:30     Package Testing and Qualification cont.

3:00     End of Seminar, certificates


Prospective Presenters and Contributors

  • Kyle Dunno, Clemson University
  • Greg Batt, Clemson University
  • Heidi Larsen, ESKOArtwork
  • Jay Sperry, Clemson University
  • Chip Tonkin, Clemson University
  • Bret Shaller, Shaller Industries

Click here to download a PDF flyer.