The Holcombe Department of Electrical and Computer Engineering

Bill Delaney

Bill DelaneyResearch Associate 
Electrical and Computer Engineering

Manager of the Micro-Photonics Fabrication Facility at AMRL

Contact Information
Office: 114 Building 91, AMRL
Office Phone: 864.656.1118

Before joining Clemson, Bill worked in private industry in various process engineering roles in the fabrication of refractive & diffractive Micro-Photonic devices. Bill worked with the founders of “Binary Optics” @ MIT Lincoln Labs from 1987-1993 as a sub-contractor, where the original technology was patented by Wilfred Veldkamp, Gary Swanson & Lim Leger. He held a process engineering position at Teledyne Brown Engineering in Huntsville Ala. from 1993-1996 in the first commercial start up for the diffractive optics technology.

Bill joined Digital Optics in 1996, assuming cleanroom construction, device fabrication and cleanroom management responsibilities for the startup fab. In May 2000 he was part of the design & procurement team that was responsible for the design, construction and qualification of Digital Optics 65,000 ft^2 Micro-Optics fabrication facility. In addition to these tasks he was responsible for the purchase of the lithography, etch & wet process tools as well as coordinating their installation and qualification.

Bill joined RFMD’s SiC/GaN power amplifier project from 2003-2005 as the lithography engineer. This startup effort required robust lithography processes for a 10 mask layer power amplifier device on a novel wafer material (SiC) and a new semiconducting material (GaN). Product was introduced to the marketplace in 2008. Bill re-joined Digital Optics in 2005 prior to the purchase of Digital Optics by Tessera Inc., a publicly traded company in California. From 2007 to 2009 Bill was tasked with identifying, purchasing, testing, installing and qualifying for production, all wafer cleaning & lithography tools for the wafer level camera effort.

From 2010 to 2013 Bill was part of a 4 person team that procured, installed, qualified & developed all lithography processes (thick & thin resist), on a TEL ACT 8 coat develop track & ASML 5500-1150C 193nm optical scanner capable of 90nm lithography.

Bill recently achieved Six Sigma Green Belt certification, through Central Piedmont Community College’s Corporate Education Program.