Office: 205 Fluor Daniel Building
Phone: (864) 656-5642
Fax: (864) 656-4435
Email: hongc@clemson.edu
Hongseok Choi joined the Department of Mechanical Engineering as an Assistant Professor in August 2013. He earned his Ph.D. in Mechanical Engineering from the University of Wisconsin-Madison in 2007 and has worked as an Assistant Scientist in the Nano-Engineered Materials Processing Center (NEMPC) at the University of Wisconsin-Madison. Dr. Choi’s expertise lies in solidification nanoprocessing, micro/nano sensors, ultrasonic joining, laser materials processing, and additive manufacturing. He has published 32 refereed journal articles, 28 peer-reviewed conference proceedings, invented 2 patents, and had 7 invention disclosures in progress. Choi currently serves as a reviewer in the Journal of Manufacturing Processes, Journal of Materials Engineering and Performance, Metallurgical and Materials Transactions A, Sensors, and IEEE Transactions on Automation Science and Engineering. He is a member of ASME, SME, and TMS.
Ph.D., University of Wisconsin, Madison, 2007
M.S., University of Wisconsin, Madison, 2002
B.S., Yeungnam University, Gyeongsan, South Korea, 1997
Scalable Nanomanufacturing of Bulk Nano-engineered Materials for High Performance and High Energy Efficiency, Smart Micro/Nanosystems for Intelligent Micro/Nanomanufacturing Technologies, Laser-based Micro/Nano Materials Processing, Micro/Nano Additive Manufacturing
Chen, Lianyi; Peng, Junyang; Xu, Jiaquan; Choi, Hongseok; Li, Xiaochun, “Achieving Uniform Distribution and Dispersion of a High Percentage of Nanoparticles in Metal Matrix Nanocomposites by Solidification Processing,” Scripta Materialia, 69(8), 634-637 (2013).
Li, Hang; Choi, Hongseok; Ma, Chao; Zhao, Jingzhou; Jiang, Hongrui; Cai, Wayne; Abell, Jeffrey A.; Li, Xiaochun, “Transient Temperature and Heat Flux Measurement in Ultrasonic Joining of Battery Tabs using Thin-film Micro Sensors,” Journal of Manufacturing Science and Engineering, 135, 051015 (2013).
Estruga, Marc; Chen, Lianyi; Choi, Hongseok; Li, Xiaochun; Jin, Song, “Ultrasonic-Assisted Synthesis of Surface-Clean TiB2 Nanoparticles and Their Improved Dispersion and Capture in Al-Matrix Nanocomposites,” ACS Applied Materials & Interfaces, 5(17), 8813-8819 (2013).
Choi, Hongseok; Cho, Woo-hyun; Konishi, Hiromi; Kou, Sindo; Li, Xiaochun, “Nanoparticle-Induced Superior Hot Tearing Resistance of A206 Alloy,” Metallurgical and Materials Transactions A, 44(4), 1897-1907 (2013).
Choi, Hongseok; Cho, Woo-hyun; Hoefert, Daniel; Weiss, David; Li, Xiaochun, “Scale-up Ultrasonic Processing System for Batch Production of Metallic Nanocomposites,” Proceedings of the 117th AFS Metalcasting Congress, American Foundry Society, St. Louis, Missouri (April 2013).
Choi, Hongseok; Konishi, Hiromi; Li, Xiaochun, “Al2O3 Nanoparticles induced simultaneous refinement and modification of primary and eutectic Si particles in hypereutectic Al-20Si alloy,” Materials Science and Engineering A, 541, 159-165 (2012).
Choi, Hongseok; Jones, Milton; Konishi, Hiromi; Li, Xiaochun, “Effect of combined addition of Cu and aluminum oxide nanoparticles on mechanical properties and microstructure of Al-7Si-0.3Mg alloy,” Metallurgical and Materials Transactions A, 43(2), 738-746 (2012).
Choi, Hongseok; Sun, Yi; Slater, Ben; Li, Xiaochun, “AZ91D/TiB2 Nanocomposites fabricated by solidification nanoprocessing,” Advanced Engineering Materials, 14, 291-295 (2012).
Choi, Hongseok; Konishi, Hiromi; Xu, Huifang; Li, Xiaochun, “Embedding of Micro Thin Film Strain Sensors in Sapphire by Diffusion Bonding,” Journal of Micromechanics and Microengineering, 17(11), 2248-2252 (2007).
Choi, Hongseok; Li, Xiaochun, “Fabrication and Application of Micro Thin Film Thermocouples for Transient Temperature Measurement in Nanosecond Pulsed Laser Micromachining of Nickel,” Sensors and Actuators A, 136, 118-124 (2007).
Zhang, Xugang; Choi, Hongseok; Datta, Arindom; Li, Xiaochun, “Design, Fabrication and Characterization of Metal Embedded Thin Film Thermocouples with Various Film Thicknesses and Junction Sizes,” Journal of Micromechanics and Microengineering, 16(5), 900-905 (2006).
Choi, Hongseok; Datta, Arindom; Cheng, Xudong; Li, Xiaochun, “Microfabrication and Characterization of Metal-embedded Thin-Film Thermomechanical Microsensors for Applications in Hostile Manufacturing Environments,” Journal of Microelectromechanical Systems, 15(2), 322-329 (2006).
Li, Xiaochun; Choi, Hongseok; Yang, Yong, “Micro Rapid Prototyping System for Micro Components,” Thin Solid Films, 420-421, 515-523 (2002).
