Micro Fabrication Facility Equipment

Wafer Cleaning & Wet Etching

3 wet hoods from Salare Systems in NC for solvent, acid & base etching and wafer cleaning

• Typical processes

  • NMP resist strip
  • RCA I & II cleaning
  • Piranha resist strip (NanoStrip 2X also available)
  • Chrome etch (CR-7)
  • Tungsten etch
  • Gold etch (GE 8148)
  • Platinum etch (Aqua Regia)
  • Nickel etch (HNO3 + Perfluoroalkyl Sulfonate)

• 

Additional Wet hoods

• Sulfuric acid, Hydrogen Peroxide (Piranha Strip)
• Hydrochloric Acid & Hydrogen Peroxide (RCA II cleaning)
• Ammonium Hydroxide  &  Hydrogen Peroxide (RCA I  cleaning)
• NMP, Acetone & Methanol (Solvents)

Resist Coating & Developing

• Semi-automated resist coater with integrated hot plate
• 100mm tooling

Brewer Sciences Photo Resist Developer Tool

• Semi-automated wafer spin developer with integrated hot plate
• 100mm tooling

UV Exposure

Nuetronix/Quintel 1X Contact/Proximity Printer

• Model Q-7000-IR

  • 365nm exposure wavelength
  • Currently configured for 100mm wafers
  • Mask tooling for 4, 5 and 7”masks
  • Tooling available for 150mm wafers
  • IR back to front alignment capable

• 

• GCA 5:1 Reduction i-line optical stepper

  • 0.45na
  • 365nm exposure wavelength
  • Critical dimension (resolution) 0.5um
  • Overlay 150nm XBar + 3 sigma
  • Currently configured for 100mm dia. wafers, can expose up to 200mm wafers 0.25mm to 1.0mm thick
  • Customized Tooling for exposing 5” X 5” X  0.150” photomasks
  • Utilizes 5” X  5” reticles
  • Processing of piece/parts is possible with custom tooling

• 

Plasma Etch

• PlasmaTherm Versaline ICP

  • Fluorine gases for SiO2 and Si & Ge etching as well as other semiconductor materials
  • Configured for 100mm wafers up to 1mm thick
  • RIE and or ICP modes
  • Primarily used to dry etch SiO2 & Si films and bulk material

• 

• Oxford Instruments Plasmalab 100 ICP

  • Utilizes CL2 & BCL3 etch chemistry for metal or dielectric etching
  • Configured for 100mm wafers up to 1mm thick
  • Tool can etch up to 10mm thick wafers with optional tooling
  • RIE and or ICP modes
  • Currently used to dry etch Sapphire & Chromium 

• 

Dielectric Conformal Deposition

Atomic Layer Deposition (ALD)

• Oxford Instruments OPAL ALD tool utilizing the following pre-cursors:

  • Diethyl zinc
  • Tetrakis(ethylmethylamino) hafnium (IV)
  • Titanium(IV) isopropoxide
  • Trimethylaluminum

• 

Metal & Dielectric Deposition

Electron Beam Deposition

• CCS CA-40 e-beam evaporator configured for 100mm wafers

• Metals

  • Gold
  • Platinum
  • Nickel
  • Titanium
  • Chromium
  • Germanium
  • Palladium
  • Tantalum
  • Iron

• Dielectrics

  • Tantalum Penta Oxide
  • Silicon Dioxide
  • Aluminum Dioxide
  • Silicon Monoxide
  • Titanium Dioxide
  • Hafnium Oxide

• 

Metrology

• Nikon Optical microscope magnification to 1500X
• Tencore Alpha Step 200 profilometer
• Hitachi S-4800 Scanning electron microscope access on site at Clemson Universities EM facility
  • http://www.clemson.edu/centers-institutes/cuadvancedmaterialscenter/electron-microscope/
• Filmetrics F20 UV Optical thin film measurement tool

Wafer Dicing

• K&S Wafer Dicing Saw

  • Model 780
  • 200mm capable
  • Cuts silicon, sapphire & optical glasses

• 

Wire Bonding

• K&S Wire Bonder

  • Model 4525AD
  • Gold wire 0.18um to 76um
  • Man & Auto
  • 152mm X 152mm area

• 

Custom Tooling

Custom tooling fees are charged on a tool by tool basis depending on the complexity of design and material needed.