Cryovac Chair leads research in packaging science
By Peter Kent
Kay Cooksey has been named to the Cryovac Endowed Chair in Clemson University’s packaging science department. A professor in the department since 1998, she is the third person to hold the prestigious post. Her first presentation in her new leadership role was keynote speaker at the Society of Plastics Engineers’ conference in December 2006.
“Overall, my vision is one of opportunity, growth and fulfillment,” said Cooksey. “It’s an opportunity for me to put more emphasis on research that could benefit our students, department, college, university and industry. The growth of our research program and recognition as a leader in this field will help us fulfill our goal to be the best packaging program in the world.”
Cooksey holds a B.S. in food science from Purdue University, an M.S. in industrial mechanical technology (emphasis in packaging) from Indiana and a Ph.D. in foods and nutrition from the University of Illinois.
For information: Kay Cooksey, 864-656-4613, email@example.com