Advance Program
The Preliminary Program has been released on April 20, EST:
LPM2026 Technical Program (Version date: April 21, 2026)
For detailed information on individual presentations within each session, please refer to the Section Details Program (Version date: April 20, 2026).
TOPICS
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LPM2026 Conference Topics
- Fundamentals of laser-materials interaction
- Modeling, simulation, and AI approaches for laser- material interactions
- Laser-based direct writing
- 3D printing and additive manufacturing
- Lithography (including EUV source and application)
- Laser synthesis and processing of functional nanomaterials
- Film deposition and synthesis of advanced materials (PLD, CVD, etc.)
- Laser-induced forward/backward transfer (LIFT/LIBT) techniques
- Laser drilling, cutting, and forming
- Micro-welding and micro-bonding
- Micro/nano-machining and fabrication
- Surface micro/nano structuring
- Surface modification (such as polishing, cleaning, shock peening, and heat treatment)
- Glass, ceramic, and other transparent materials processing
- Process monitoring and control
- Beam shaping
- Novel systems and Processes (VUV laser, X-ray, and GHz bursts and more)
- Laser sources and systems
- Packaging and mounting process
- Manufacturing of micro-devices and systems
- Sensing, diagnostics, and instrumentation
- Laser processing for battery, fuel-cell, electrolyzer, fusion energy, and other energy devices
- Laser material processing for extreme environments
- Other industrial applications (energy, semiconductor, aerospace, biomedical, manufacturing, automotive, and more)
- Special sessions: (1) In-situ Metrology for laser micro machining: (2) AI for laser micro machining
