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November Newsletter 2018
Read more about the following topics in our November newsletter! One Clemson packaging student was awarded a PACK EXPO scholarship […]

Student awarded PACK EXPO Scholarship
It was announced at PACK EXPO International in Chicago last month, that one of Clemson's Packaging Science students, Ray Cummings, […]

CU packaging group returns from PackExpo International
Packaging Science students pose for a group photo at PackExpohttps://youtu.be/IIsUk7SYsnk Clemson University's packaging division was highly involved in this year's PackExpo International show at McCormick Place in Chicago, IL. […]

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