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P3 Forum ‘Change’ reunites packaging-graphics alums Oct. 22-23
Graphic communications and packaging science professionals who graduated from Clemson University put a premium on staying connected. As a result, the inaugural P3 Forum (People + Printing + Packaging) in 2017 has become an annual event where alumni in the package printing industry gather for two days, Oct. 22-23, to renew acquaintances, share best practices, […]

Clemson’s Sonoco Institute announces fall seminar and workshop lineup
The Sonoco Institute of Packaging Design and Graphics at Clemson University is offering courses for industry professionals this fall, covering a wide range of topics in printing and packaging. Courses include an Introduction to Flexography Workshop, Proofing and Visualization Seminar, Paperboard Packaging Seminar, Corrugated Packaging Seminar, Process Color Management Seminar and Flexo Foundations Seminar.

Clemson’s Sonoco Institute welcomes new corporate member Digimarc Corporation
Clemson University’s Sonoco Institute of Packaging Design and Graphics welcomed new Corporate Member Digimarc Corporation to the ranks of its current members. Digimarc supports research and development activities, stimulates unique educational opportunities and ensures cutting-edge laboratory infrastructure at the Sonoco Institute.

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More News

November Newsletter 2018
Read more about the following topics in our November newsletter! One Clemson packaging student was awarded a PACK EXPO scholarship […]

Student awarded PACK EXPO Scholarship
It was announced at PACK EXPO International in Chicago last month, that one of Clemson's Packaging Science students, Ray Cummings, […]

CU packaging group returns from PackExpo International
Packaging Science students pose for a group photo at PackExpo Clemson University's packaging division was highly involved in this year's PackExpo International show at McCormick Place in Chicago, IL. […]

October Newsletter 2018
The students have been working hard and have some cool stories to tell - here's what you will find in […]

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