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Paperboard Packaging Seminar

Event Overview:

This seminar provides a comprehensive, hands-on exploration of Paperboard Packaging Technologies. Upon completing this program, attendees will be equipped to make valuable contributions to critical packaging decisions. Individuals involved in package design, sales, specification, purchasing, scheduling, quality control, and production management will benefit from this seminar. This seminar is appropriate for all levels of experience.

Presentations Topics Include:

  • Paperboard Substrates and Applications
  • Paperboard Manufacturing
  • Characteristics of Paperboard
  • Packaging Sustainability
  • Package Design
  • Prepress
  • Printing and Converting

Hands-on Sessions:

  • Packaging Materials
  • Manufacturing Effects
  • Characteristic Test Comparisons
  • Design Breakout Session
  • Printing Comparisons
  • Die Cutting and Scoring

Previous Presenters and Contributors:

  • Dan Malenke, PKGPRO
  • Ken Perry, Kapstone Charleston Kraft
  • Phil Bradley, MWV
  • Pat Shields, RockTenn
  • Andrew Hurley, Clemson
  • William Beck, MWV
  • Greg Bachmann, Bachmann & Associates
  • Jim Hare, Kapstone Charleston Kraft
  • Lizzy Zinn, Epic Products
  • Aric Naylor, Atlas Die
  • Bill Sommer, Sonoco Products
  • Phil Jones, Imerys
  • Eric Ferguson, DataLase
  • Chuck Tarlton, Graphic Packaging
  • Gary Bernier, HP Indigo
  • Tom Blanck, Chainalytics
  • Kemp Wall, Essentra
  • Paul Schutes, Recycled Paper Technical Association

The Sonoco Institute follows Clemson University protocol for COVID-19. Please click here for more information.


  • $995/person
  • $895/person for early bird or groups of 3+
October 20-21, 2021. Enroll Now!

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Cancellation Policy: 21 days prior to event date for 100% refund; 14 days prior to event date for 50% refund; no refund will be given less than 14 days. Email